Potting & Encapsulation

Potting is the process of sealing or embedding electronic components & assemblies in a liquid resin ( potting compounds ) surrounded by a plastic shell.  Performing the potting process on electronics will stop corrosion of metals, shortages, and reduce damage caused by vibration and mechanical stress.   Polyurethane, epoxy, acrylic, silicone and UV cure are the materials we use with the potting process.  These materials vary in hardness from soft gels to hard plastics and are designed to withstand many specific types of environments. Some have excellent thermal conductivity while others have outstanding chemical or moisture resistance and all these materials provide good dielectric properties and have a wide range of additional properties to select from.

Low Cost

Potting can be one of the lowest cost options to seal your electronic components from the surrounding environment. We provide low, medium and high volume potting services. Potting materials have a wide variety of properties from which to choose, from soft gels to hard plastics and from thermally insulating to thermally conductive.

Encapsulation is very similar to potting in a plastic shell although instead of having a shell injection molded we can replace the shell with a reusable mold.   The encapsulation process works well with low to medium volumes because a meter mix dispense machine can be used for filling the molds but is not necessary.   The materials that we use with the encapsulation process are polyurethane, epoxy and silicones which are processed at room temperature or slightly elevated.  We will be glad to work with you from the initial stages of the product design.